Messe Düsseldorf has announced the Shanghai World of Packaging (swop) show will take place at the Shanghai New International Expo Centre in November next year.

The show will cover end use industries such as food, beverage, confectionery, baked goods, pharmaceuticals, cosmetics and daily care products, non-food consumer goods and industrial goods, providing an encompassing trading platform for manufacturers of processing and packaging machinery and materials.

It will have a focus on artificial intelligence, printing and labelling, e-commerce and logistics packaging, personalized packaging, and packaging design with the aim to provide innovative packaging solutions and showcase intelligent processing and packaging production lines for the entire industry chain. It offers five special exhibition areas to cover all hot spots of the packaging industry.

The Save Food initiative from the partners Messe Düsseldorf, the FAO and UN Environment aims to drive innovations, promote interdisciplinary dialogue and spark debate in order to generate solutions across the entire value chain from field to fork and make a contribution against global food losses. The initiative began at swop last year. This year, it will share innovative concepts and technologies with the public.

For manufacturers of packaging materials and products, the FMCG Future Zone will showcase the latest packaging materials, ideas, technologies and new products/designs for end use industries such as food, cosmetics and pharmaceuticals.

Organisers say that the influence of digital technology, artificial intelligence and environmental protection policies have led to three major trends: digital printing, smart packaging, and green printing. A special print area will debut at swop 2019 with the latest printing and labelling equipment and technologies for the packaging industry.

The new Smart Packaging Zone will display all-in-one smart packaging of functional materials, structural intelligent packaging and information-based smart packaging as well as the related technical applications. swop 2019 will also focus on the display of new technologies for information-based packaging, so as to enhance the role of packaging in the supply chain as a carrier, increase the added value of packaging, provide a market basis and strategic direction for industrial transformation and upgrading, and further improve the service function of packaging

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