Entries have opened for Packaging New Zealand’s annual scholarship programme.
The scholarship enables a packaging technologist, designer or engineer in New Zealand the opportunity to complete a Diploma in Packaging Technology to the value of $9,000. The Diploma of Packaging Technology is offered through the Australian Institute of Packaging (AIP).
Harry Burkhardt, president of Packaging New Zealand, says, “The association is extremely proud to be able to offer the scholarship to a New Zealand packaging professional each year.
“The packaging industry is dynamic and diverse, offering career opportunities across a wide scope of disciplines. Packaging New Zealand has been representing businesses in the packaging industry in New Zealand since 1992 and recognises that investment in the packaging industry starts with in its people. We strongly encourage everyone in the industry to apply for this scholarship.”
“The Diploma in Packaging Technology is a Level 5 qualification which is internationally recognised for those wishing to pursue a career in the packaging industry or for those who are already in the industry and who wish to extend their knowledge and expertise. The Diploma in Packaging Technology prepares students to take responsibility for packaging operations at any level through the supply chain. The qualification is comprehensive and provides an opportunity to study the principles of packaging, packaging materials and packaging processes.”
Diploma in Packaging Technology students come from a variety of backgrounds and disciplines, and are typically experienced practitioners or managers in technical, sales/marketing, QA, purchasing, engineering or design.
Packaging New Zealand says completion of the Diploma in Packaging Technology demonstrates a commitment to your career and to the industry. Delegates who successfully complete the Diploma equip themselves for senior positions within the packaging industry.
Entries close on the March 8. Packaging New Zealand will announce the winner of the scholarship will be announced at the 2019 Packaging Innovation & Design Awards; which will take place at the Sofitel Wentworth, Sydney on April 30.
Click here to find out more about the scholarship criteria and entry forms or email pida@aipack.com.au or visit the below links
http://aipack.com.au/wp-content/uploads/2019_PIDA_Diploma_PACNZ_Scholarship_Criteria.pdf
http://aipack.com.au/wp-content/uploads/2019_PIDA_Diploma_PACNZ_Scholarship_Entry.pdf
