The Packaging Council of New Zealand has sent out a reminder that its scholarship programme, launched in conjunction with the Australian Institute of Packaging, has opened for entries.
The programme will enable one packaging technologist, designer, or engineer in New Zealand the opportunity to complete a Diploma in Packaging Technology to the value of $9,000. Harry Burkhardt, president of the Packaging Council of New Zealand, says, “The association is extremely proud to be able to offer the scholarship to a New Zealand packaging professional each year.
The Level Five qualification offers internationally recognition for those wishing to pursue a career in the packaging industry or for those already in the industry and who wish to extend their knowledge and expertise. He says, “The Diploma in Packaging Technology prepares students to take responsibility for packaging operations at any level through the supply chain. The qualification is comprehensive, and provides an opportunity to study the principles of packaging, packaging materials and packaging processes.”
He adds that Diploma in Packaging Technology students hail from a variety of backgrounds and disciplines, and typically have experience as practitioners or managers in technical, sales, marketing, QA, purchasing, engineering, or design. PAC.NZ says completion of the Diploma in Packaging Technology demonstrates commitment to career and to the industry. Delegates who successfully complete the Diploma equip themselves for senior positions within the packaging industry.
He says, “The packaging industry is dynamic and diverse, offering career opportunities across a wide scope of disciplines. PAC.NZ has been representing businesses in the packaging industry in New Zealand since 1992 and recognises that investment in the packaging industry starts with investment in its people. We strongly encourage everyone in the industry to apply for this scholarship.
Entry submissions close on February 23. PAC.NZ will announce the winner of the inaugural Packaging Council of New Zealand Scholarship at the 2018 Packaging & Processing Innovation & Design Awards; which will take place alongside of the international WorldStar Packaging Awards on the May 2.
Click here to get an entry form and to find out more about the scholarship criteria and entry forms, email pida@aipack.com.au
