Morgana has launched a new PUR binder, the DigiBook 300 XL Pro, which adds landscape A3 capabilities to the range.
Print & Pack supplies Morgana equipment in New Zealand.
Morgana says the DigiBook 300 XL Pro targets traditional and digital printers who require short runs of PUR perfect bound books to a professional standard. It requires single phase power, rather than three phase.
The DigiBook 300 XL Pro binder has an increased input cover size of 450×1,000mm, compared with the 350x700mm maximum format of its predecessor, the DigiBook 300. It can now produce landscape A3 jobs, and produce up to 300 books per hour.
Ray Hillhouse, vice president offline business at Morgana, says, “We were getting requests for larger books in some markets. For example, in Asia where the photobook market is huge, they were pushing for a larger size.
“Perhaps the most significant change is the book format. Several machines of the previous specification were sold with special extended cover kits to allow for the production of books larger than A4 size. We also had a number of requests for landscape A3 or 11x17in finished size books.”
“These machines are equipped with a patented closed gluing system where the spine and side gluing is applied by a slot applicator for the utmost binding quality and accuracy. It is easy to use, even by non-specialised personnel, via a touch screen panel with icon graphics that allow the programming of all precision operations in just a few seconds, including startup and shutdown.
“There are a thousand alphanumeric memories available, which enable repeat jobs to be saved for later recall, thus providing totally automatic setup in a few seconds. The DigiBook 300 XL Pro binding machine uses a new and innovative system which is covered by no less than seven international patents.”
Options include a gauze station for the production of book blocks ready for case binding and a 78-litre capacity paper chip extractor that allows for longer, uninterrupted runs.
Hillhouse adds that PUR provides a stronger bind than hotmelt glues, can be used on a wider range of substrates and is more resistant to the effects of temperature and humidity.